WAFER RING FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

A wafer ring for manufacturing a semiconductor package is provided to prevent more than two wafers from being lifted at the same time by suppressing a vacuum condition in inter-wafer spaces. Wafers are laminated with a wafer ring(10a) between them. The wafer ring is arranged on an outer periphery of the wafer, such that a contact interference between the wafers is prevented. The wafer ring includes a horizontal mounting terminal(14) and a vertical terminal(20). The wafer is mounted on the horizontal mounting terminal. The vertical terminal is vertically formed on an outer end of the mounting terminal. An air ventilating hole(22) is formed at four portions on the vertical terminal, such that a vacuum condition is suppressed.