SOLDERING APPARTUS AND CONTROL METHOD THEREOF

摘要

An automatic lead-free soldering apparatus and a method for controlling the same are provided to improve the quality of a lead-free solder by continuously maintaining temperature of a soldering iron and the length of the lead-free solder to a constant level. An automatic lead-free soldering apparatus comprises a case(100), an elevating device(200), a transfer device(300) and a support(400). The case is provided at a rear surface thereof with a fixing plate(202). A soldering iron(220) protrudes from a front surface of the case. The elevating device elevates the fixing plate along rods(201), which are fixed to an upper plate of the case, as a first cylinder(210) is operated. The first cylinder is installed at a lower surface of the fixing plate on which the soldering iron is installed.