POLYIMIDE COMPOUND AND FLEXIBLE WIRING BOARD

摘要

A polyimide compound which is prepared by a method comprising reacting an acid dianhydride having high linearity in its molecular shape with a diamine and then carrying out an imidation reaction to a high imidation percentage; and a flexible wiring board which has a polyimide layer comprising the polyimide compound. The above polyimide compound has a thermal linear expansion coefficient which is low and near to that of an electroconductive material, and thus can reduce the effect of the reaction shrinkage occurring due to the dehydration reaction during the formation of a polyimide. The above flexible wiring board can be free from curling.