SEMICONDUCTOR DEVCIE HAVING PADS

摘要

A semiconductor device having pads is provided to reduce a plane area occupied by the pads and optimize an arrangement of the pads by arranging first and second via contact portions in one row. First pads(150) and second pads(160) are arranged on an interlayer dielectric in first and second rows, respectively. First via contact portions(155) extend from the first pad toward the second row, and second via contact portions(165) extend from the second pads toward the first row. At least one first via plug(135a) is disposed in the interlayer dielectric under the first via contact portion, and at least one second via plug(135b) is disposed in the interlayer dielectric layer under the second via contact portion.