MODULE COMPRISING RADIATION-EMITTING SEMICONDUCTOR BODIES

摘要

The invention relates to a module comprising a regular arrangement of individual, radiation-emitting semiconductor bodies (1) applied to an assembly surface (6) of a carrier (2). According to the invention, a wire joint between two adjacent, radiation-emitting semiconductor bodies (1) is applied to the upper side of the two radiation-emitting semiconductor bodies (1), opposing the assembly surface (6).