MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREOF

摘要

A semiconductor package and a manufacturing method thereof are provided to reduce a loss in generated light by suppressing a delamination between upper and lower substrates. A semiconductor package includes a substrate(85) and a reflective plate(94). A tapered cavity is formed on an upper surface of the substrate. The reflective plate is formed along an inner surface of the cavity to a predetermined thickness. The reflective surface is formed, such that first and second pattern electrode surfaces(93,95) are separated from each other by a laser. The reflective surface is plated on the cavity to a predetermined thickness. The first and the second pattern electrode surfaces are separated from each other by an insulation material. The substrate is made of a ZnO-group varistor.