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发明名称
发光元件之封装结构
摘要
本发明系有关于一种封装结构,尤指一种发光元件之封装结构,主要系于一供电基板上设置有一发光二极体,而发光二极体之第一电极及第二电极系分别与供电基板上所设置之第一供电电路及第二供电电路相连接,再使得供电基板之第一供电电路及第二供电电路分别与一导电架相连接,藉此将可不经由打线的制程便可完成导电架与发光二极体之电性连结,并直接以导电架对发光二极体进行供电。
申请公布号
TW200742121
申请公布日期
2007.11.01
申请号
TW095115422
申请日期
2006.04.28
申请人
林三宝
发明人
林三宝
分类号
H01L33/00(2006.01)
主分类号
H01L33/00(2006.01)
代理机构
代理人
张秀夏;黄淑芬
主权项
地址
桃园县中坜市民权路3段75巷61弄26号
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