| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an easy, definite and stable manufacturing method of an IC card excellent in smoothing by using an adhesive sticking method even when an IC chip part is thick. <P>SOLUTION: In the manufacturing method of the IC card for interposing an IC inlet comprising an IC chip and an inlet film including an antenna between two base materials, sticking the two base materials by an adhesive and pressurizing them by rolls 30 and 40 facing each other, when a fixed gap between the rolls 30 and 40 facing each other is defined as (a), the material total thickness of a part with the IC chip before pressurization by the rolls is defined as (b) and the material total thickness of a part without the IC chip is defined as (c), the manufacture is carried out satisfying 1.0<b/a≤1.4 and 1.0<c/a≤1.1. <P>COPYRIGHT: (C)2008,JPO&INPIT |
