| 摘要 |
A method is provided to cut a sheet according to the shape of a corresponding wafer by installing a cutter blade in a separate position outside a regular trace and by slowly modifying the posture of the cutter blade in a process for approaching the cutter blade to the normal trace. A cutter blade(12) is relatively transferred along the outer circumference of a plate-type member(W) so that a trace along which a sheet(S) is cut along the plate-type member is regarded as a normal trace. A separate position outside the normal trace is regarded as a cutting start position, and the cutter blade is inserted into the sheet. While the cutter blade is inserted into the sheet, the cutter blade is relatively transferred to gradually approach the normal trace and to cut the sheet. While the cutter blade is positioned on the normal trace, the cutter blade is relatively transferred to cut the sheet according to the shape of the plate-type member. While the cutter blade is supported by a numerically controlled multi-joint robot(11), the posture of the cutter blade is controlled.
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