A SEMICONDUCT TAPE AUTOMATED BONDING PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor bonding package and a manufacturing method thereof are provided to easily contact a circuit line with a bump of a semiconductor chip by forming the circuit line, while the semiconductor chip is inserted into a bare film substrate. A semiconductor bonding package includes a film substrate(200), a semiconductor chip, and a circuit line(220). A mount hole is formed on the film substrate. The semiconductor chip is inserted into the mount hole of the film substrate. A bump(125) is formed on a surface of the semiconductor chip. The circuit line is formed to be contacted with the bump on one surface of the film substrate and the semiconductor chip. An insulation film(110) is formed between the bumps.