| 摘要 |
PROBLEM TO BE SOLVED: To form a fine pattern on an Si top plate having irregularities. SOLUTION: An organic polymer compound is contained in an epoxy resin composition so as to allow it to have the molecular weight of 900-100,000 and the content of 5-50 wt.%. The epoxy resin composition is made to be a dry film, so that the thickness of the film can be precisely controlled. COPYRIGHT: (C)2008,JPO&INPIT
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