PACKAGE-ON-PACKAGE STRUCTURES

摘要

A POP (package-on-package) structure includes a first and a second semiconductor chip and a connecting structure. The first semiconductor chip is disposed on a first substrate that includes a plurality of first internal terminals and a plurality of first external terminals. The second semiconductor chip is disposed on a second substrate that includes a plurality of second internal terminals and a plurality of second external terminals. The connecting structure electrically connects at least one of the first external terminals to at least one of the second external terminals.