发明名称 CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROCESS OF MAKING SAME, PACKAGES CONTAINING SAME, AND SYSTEMS CONTAINING SAME
摘要 A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die, an interposer-type structure for a flip-chip, a mounting substrate, or a board. The CNT array is patterned by using a patterned metallic seed layer on the substrate to form the CNT array by chemical vapor deposition. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.
申请公布号 WO2007123778(A1) 申请公布日期 2007.11.01
申请号 WO2007US08037 申请日期 2007.03.31
申请人 INTEL CORPORATION;RARAVIKAR, NACHIKET;SUH, DAEWOONG 发明人 RARAVIKAR, NACHIKET;SUH, DAEWOONG
分类号 H01L23/485;C01B31/02;H01L21/60 主分类号 H01L23/485
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