| 发明名称 |
RADIATION-SENSITIVE INSULATING RESIN COMPOSITION |
| 摘要 |
<p>Disclosed is a radiation-sensitive insulating resin composition which enables to obtain a cured product excellent in electrical insulation, resolution, adhesion and thermal shock resistance in a balanced manner. Specifically disclosed is a radiation-sensitive insulating resin composition which is characterized by containing a compound (A) having a disulfide structure, a resin (B) and a radiation-sensitive compound (D). It is preferable that the radiation-sensitive insulating resin composition further contains, if necessary, a compound (C) having a functional group reactive with an alkali-soluble resin (B1) and a crosslinked fine particles (E) having an average particle diameter of 30-500 nm.</p> |
| 申请公布号 |
WO2007122929(A1) |
申请公布日期 |
2007.11.01 |
| 申请号 |
WO2007JP55397 |
申请日期 |
2007.03.16 |
| 申请人 |
OKUDA, RYUICHI;JSR CORPORATION;ITO, ATSUSHI;SASAKI, HIROFUMI;GOTO, HIROFUMI |
发明人 |
ITO, ATSUSHI;OKUDA, RYUICHI;SASAKI, HIROFUMI;GOTO, HIROFUMI |
| 分类号 |
C08K5/22;C08L101/12;C08K5/36;G03F7/004;H01L21/312 |
主分类号 |
C08K5/22 |
| 代理机构 |
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代理人 |
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| 主权项 |
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