发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To realize a semiconductor device in which an extension region may not extend in the lower part of a gate electrode and a junction leakage current may not be generated when a shared contact is formed. <P>SOLUTION: The semiconductor device is provided with an active region 12 formed on a portion surrounded by an element isolation region 11 in a semiconductor substrate 10; a first gate structure 23A having a gate insulating film 21A, and a first gate electrode film 22A formed on the active region 12; a first offset spacer 24A formed on the side surface of the first gate structure 23A, and having a height lower than that of the first gate structure 23A; and a first sidewall 25A formed on the side surface of the gate structure 23A, so as to cover the side surface and the upper end surface of the first offset spacer 24A. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007287791(A) 申请公布日期 2007.11.01
申请号 JP20060110967 申请日期 2006.04.13
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SATO YOSHIHIRO
分类号 H01L21/8234;H01L21/28;H01L21/8244;H01L27/088;H01L27/11;H01L29/41 主分类号 H01L21/8234
代理机构 代理人
主权项
地址