| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device capable of achieving fine mounting precision management by using inspection information obtained in each process properly, and to provide a mounted state inspection apparatus and a method of mounting an electronic component. <P>SOLUTION: In the electronic component mounting, a mounted substrate is manufactured by an electronic component mounting system composed by connecting a plurality of devices for mounting electronic components. Solder position data, where the position of solder printed onto a substrate is detected by a print inspection apparatus, are transmitted to the electronic component mounting device and the mounted state inspection apparatus as feedforward data. A control parameter for controlling the component mounting operation of the electronic component mounting device and an inspection parameter for indicating a reference component position in mounted state inspection are updated based on the solder position data. <P>COPYRIGHT: (C)2008,JPO&INPIT |
