| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid processing device for doing liquid processing by supplying a process liquid to a substrate while rotating the substrate, which can control a mist of the process liquid to re-adhere onto the substrate. <P>SOLUTION: The liquid processing device has a wafer holder 1 that holds a wafer W horizontal and is rotatable together with the wafer W, a rotational cup 3 that surrounds the wafer W held by the wafer holder 1 and is rotatable together with the wafer W, a surface processing liquid supply nozzle 4 that supplies a process liquid onto the surface of the wafer W, and an exhaust/drainage section 6 that exhausts the air and drains the liquid of the rotational cup 3. The rotational cup 3 has a gas accumulating section 32a that can trap an airflow coming in from the outside onto the wafer W held by the wafer holder 1. <P>COPYRIGHT: (C)2008,JPO&INPIT |
