发明名称 |
METHOD OF REMOVING CONDUCTIVE METAL OXIDE THIN-FILM AND APPARATUS THEREFOR |
摘要 |
<p>Opposed to conductive metal oxide thin-film (12) lying on a surface of base material (11), positive electrode (13) and first negative electrode (14) are disposed in parallel in a noncontact state. Between the positive electrode (13) and the first negative electrode (14), there are disposed multiple second negative electrodes (17) arranged in a contact state in the direction of width of conductive metal oxide thin-film (12). While electrolytic solution (15) lies in the interspaces of conductive metal oxide thin-film (12) and electrodes (13), (14) and (17), relative displacement of the base material (11) is carried out so that the conductive metal oxide thin-film (12) first passes the negative electrodes (14) and (17) and thereafter passes the positive electrode (13). As a result, the conductive metal oxide thin-film (12) is removed by reduction reaction.</p> |
申请公布号 |
WO2007122752(A1) |
申请公布日期 |
2007.11.01 |
申请号 |
WO2006JP318968 |
申请日期 |
2006.09.25 |
申请人 |
HITACHI ZOSEN CORPORATION;HITZ HI-TECHNOLOGY CORPORATION;DAIKU, HIROYUKI;INOUE, TETSUYA;SUGIMOTO, TAKANOBU |
发明人 |
DAIKU, HIROYUKI;INOUE, TETSUYA;SUGIMOTO, TAKANOBU |
分类号 |
H01L21/3063;C03C23/00;C25F3/02 |
主分类号 |
H01L21/3063 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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