| 发明名称 |
LIGHT EMITTING DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device with which deterioration of reliability of a connector and other structure members by reflow mounting can be prevented and device assembly work can be simplified. <P>SOLUTION: The light emitting device is provided with an LED element 2, a flexible substrate 3 having circuit patterns 3B and 3C connected to the LED element 2 and an outer connection contact 6 connected to the circuit patterns 3B and 3C and a heat dissipating member 4 which is fitted to the flexible substrate 3 and radiates generated heat by the LED light emitting element 2. A through hole 5 which thermally connects the heat dissipating member 4 and the LED element 2 is formed in the flexible substrate 3. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2007287751(A) |
申请公布日期 |
2007.11.01 |
| 申请号 |
JP20060110121 |
申请日期 |
2006.04.12 |
| 申请人 |
TOYODA GOSEI CO LTD;IITEKKU KK |
发明人 |
HAYASHI KINJI;KAGA KOICHI;YASUKAWA TAKEMASA;TABATA SATORU |
| 分类号 |
H01L33/64;H01L23/36;H01L33/32;H01L33/56;H01L33/62;H05K1/02 |
主分类号 |
H01L33/64 |
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