| 摘要 |
PROBLEM TO BE SOLVED: To provide a case for housing a printed wiring board capable of effectively preventing bedewing, which may be factors of migration, caused by blowing of exposed conductors on a surface of the printed wiring board with vapor containing moisture. SOLUTION: In the case 10 for housing the printed wiring board 15, prepared with a connector insertion hole 10a into which a connector 13 to be connected with the printed wiring board 15 is inserted, a bedewing prevention plate 14 for preventing bedewing on the exposed conductor on the surface of the printed wiring board 15 is formed in such a way that the plate 14 locates in a place between a periphery of a lead 13a of the connector 13 and any one at least IC and chip capacitors (16a, 17a) in fine pitch QFP shapes arranged on the printed wiring board 15. COPYRIGHT: (C)2008,JPO&INPIT
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