| 摘要 |
PROBLEM TO BE SOLVED: To provide a transferring method of a metal oxide thin film element for forming a transparent wiring having sufficient adhesive properties, high light transmission, low resistance, high definition, high reliability, insulation properties and satisfying such requirement as a reduced cost, short delivery time, a low environmental load, etc. not only on a glass substrate but also on a substrate (an object to be transferred) comprising a polymer-based material as a circuit board. SOLUTION: This method is for selectively transferring a thin film element of a transfer unit having a metal oxide thin film element that is formed on a substrate to an object to be transferred. The transfer unit is provided with a photothermal conversion layer at least on one surface of the substrate and the thin film element. The transfer unit and the object to be transferred face each other via an adhesive layer, and the photothermal conversion layer is selectively irradiated with a laser beam. By the obtained heat, the adhesive layer is selectively melted/softened. The thin film element and the object to be transferred are selectively bonded together. The thin film element that is selectively bonded is separated from the transfer object, and then the transfer layer is formed on the object to be transferred. COPYRIGHT: (C)2008,JPO&INPIT
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