发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus having a shortened cycle time. SOLUTION: In the substrate processing apparatus for applying each processing to a substrate 4 while conveying the substrate 4, a processing liquid supplying apparatus 1 and a drying apparatus 3 are sequentially arranged at least in the conveying direction of the substrate 4. The drying apparatus 3 consists of an air knife 20 for drying the processing liquid to the substrate 4, a plurality of nozzles (11a-11d) for supplying the processing liquid on the substrate 4 are provided on the processing liquid supplying apparatus 1, and at least the nozzle 11d in the final stage among these nozzles is directed in a direction opposite to the conveying direction of the substrate 4. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007287753(A) 申请公布日期 2007.11.01
申请号 JP20060110147 申请日期 2006.04.12
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIMAI FUTOSHI;KAWADA SHIGERU
分类号 H01L21/027;H01L21/304;H01L21/306 主分类号 H01L21/027
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