| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting method and an apparatus for bonding an electronic component to a circuit board with good productivity and high reliability, without requiring a resin sealing process and a bump leveling process after the circuit board and the electronic component are bonded. SOLUTION: In the method, while interposing insulating resins 6, 6b and 10, containing inorganic fillers 6f between bumps 3 formed on electrodes 2 of an IC chip 1 and board electrodes, the bumps and the board electrodes are aligned; and while pressing the chip to the board by a head 8 at a welding pressure of 20 gf or more per bump to correct the warpage of the chip and the board and to crush the bumps, the insulating resins are cured to bond the chip and the board. COPYRIGHT: (C)2008,JPO&INPIT |
