| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to realize a compact chip size by avoiding an increase of a layout area for arranging a driver and a wiring, while adopting an SCRC system. SOLUTION: A semiconductor device is constituted by providing: a main power supply wire L1 for feeding a power supply potential VCC; a main earth wire L2 for feeding an earth potential VSS; PMOS transistors P1, P2; a PMOS transistor P3 connected between each source of the PMOS transistors P1, P2 wherein the main power supply wire L1 is connected to a connection node of one side and a sub power supply potential VCT is generated at a connection node of the other side; NMOS transistors N1, N2; and an NMOS transistor N3 connected between each source of the NMOS transistors N1, N2 wherein the main earth wire L2 is connected to a connection node of one side and a sub earth potential VST is generated at a connection node of the other side. COPYRIGHT: (C)2008,JPO&INPIT |
