| 摘要 |
A substrate structure for a semiconductor a package and a package method thereof are disclosed. A plurality of independent module substrates are arranged on a metal or heat-resistant frame that has a hollow portion and those module substrates are suspended and connected with the frame by a plurality of connecting bars. A molding component is utilized to respectively cover those module substrates. Then punch, and grind the plurality of rugged bumps of those connecting bars to form a plurality of independent module packages, wherein the cover area of the molding component is larger than the size of each the module substrate. The metal or heat-resistant frame is utilized to replace the conventional side rail design so as to increase the usable area of the substrate to substantially come to the cost reduction of the substrate. |
