| 摘要 |
<p>A substrate aligning apparatus is provided to improve the accuracy of substrate alignment by easily determining the substrate alignment and easily adjusting an alignment error, and perform accurately deposition of thin film and patterning process. A transfer unit(30) transfers a wafer to a platform(20), and has a positioning member for adjusting an aligning position of the substrate. A first alignment detecting unit(40) is connected to the transfer unit to determine whether the substrate is aligned with the transfer unit. A second alignment detecting unit(50) is positioned on the platform to determine whether the substrate is aligned with the platform. The positioning member of the transfer unit adjusts the position of the substrate with respect to the transfer unit.</p> |
