| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a resin seal of a surface mount resin-sealed package from bending in LOC. <P>SOLUTION: A semiconductor device 42 using the surface mount resin-sealed package in LOC has a rectangular chip 24 which has a bonding 26 on a first principal surface, a resin seal 40 with which the chip 24 is sealed, a first lead, and a second lead. The first lead has a first inner lead 17 the top of which is fixed along a long side of the first principal surface of the chip 24, and a first outer lead 18 which is exposed from a long side of the resin seal 40. The second lead has a second inner lead 22 sealed with a short side of the resin seal 40, a bending prevention lead 20 bent between a short side of the chip 24 and the short side of the resin seal 40, and a second outer lead exposed from a long side of the resin seal. Since a volume of a part of the resin seal near the chip is divided into top and bottom by the bending prevention lead, the bending can be prevented. Since the bending prevention lead is settled in resin injection, resin balance can be improved. <P>COPYRIGHT: (C)2008,JPO&INPIT |
