| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is capable of preventing mechanical and thermal damages to a semiconductor device and is excellent in reliability and productivity. <P>SOLUTION: The method for manufacturing a semiconductor device forms an electrode on the semiconductor device, forms a conductive bump on the electrode, disposes an external wiring on the conductive bump, and laser-welds the external wiring and the conductive bump so as to be electrically connected. Thus, this allows a preferable method to be provided to manufacture a semiconductor device for a big current application or a low resistance application. <P>COPYRIGHT: (C)2008,JPO&INPIT |
