INTEGRATED CIRCUIT MOUNTING SUBSTRATE AND POWER-LINE CARRIER COMMUNICATION APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a small integrated circuit mounting substrate in which an impact of noise is reduced, and to provide a power-line carrier communication apparatus.

SOLUTION: The substrate mounting an integrated circuit arranged to modulate and demodulate a multicarrier signal comprises a lamination substrate internally having a plurality of conductive layers laminated through an insulating layer, and an integrated circuit mounted on the surface of the lamination substrate and having a plurality of ground terminals to be grounded. Out of the plurality of conductive layers, a conductive layer arranged closest to the integrated circuit constitutes a ground layer connected electrically with the plurality of ground terminals.

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