| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus that reduces manufacturing cost, simplifies a manufacturing process, and enhances a manufacturing yield. SOLUTION: The semiconductor manufacturing apparatus 10 comprises a polishing means 4 for thinning a semiconductor wafer 1 by polishing and a supporting pedestal 5 for supporting a second surface which is the opposite side of a first surface polished by the polishing means 4 in the semiconductor wafer 1, wherein stress acting portions 6 for locally concentrating stress by polishing applied to the second surface are formed on the supporting pedestal 5 along a plurality of dividing lines along which the wafer 1 is divided. Thereby, the reduction of the manufacturing cost, the simplification of the manufacturing process, and the enhancement of the manufacturing yield can be achieved. COPYRIGHT: (C)2008,JPO&INPIT |
