| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce, in an electronic device such as a notebook-computer, contribution of a built-in air cooling fan unit of the electronic device to temperature rise within the electronic device. <P>SOLUTION: The cooling part comprises a heat radiation rubber 50 closely fitted to both a frame body 51 of the air cooling fan unit 50 and a casing 210 of the electronic device such as a notebook computer. The heat of the fan unit 50 is transferred to the casing 210 through the heat radiation rubber 60, and the casing unit 210 is used as a radiator. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
