| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting device capable of preventing poor quality in junction when mounting a thin semiconductor package by solder bonding, and to provide a solder paste transfer unit and a method for mounting an electronic component. SOLUTION: When the electronic component, where a plurality of solder bumps are formed on a lower surface, is mounted onto a substrate; a paint film baseplate 21 is attached to the solder paste transfer unit 19 in a solder paste transfer process performed before mounting the component onto a substrate. In the paint film baseplate 21, a flexible metal thin film is formed in a shape having a sectional shape capable of forming a paint film having thickness according to the distribution of a desired amount of transfer of solder paste to a solder bump 11 in the electronic component 10. A solder paste 23 having film thicknesses t1, t2 according to the desired amount of transfer is formed on the paint film baseplate 21, thus supplying the solder paste 23 having a desired amount of transfer to each solder bump 11 by transfer. COPYRIGHT: (C)2008,JPO&INPIT
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