| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for transferring a metal thin film element for forming wiring to satisfy requirements such as sufficient adherence to a board (transferred material) composed of not only a glass substrate but a polymeric material as a circuit board, low resistance, high definition, high reliability, insulation, moreover, low cost, short delivery, and low environmental load. SOLUTION: Provided is a method for selectively transferring a thin film element of a transfer body having a metal thin film element formed on a base material onto a transferred material, and the transfer body includes a photothermal conversion layer at least on one surface of the base material and the thin film element, and the transfer layer is formed on the transferred material by making the transfer body and transferred material face each other via an adhesive layer, selectively irradiating to the photothermal conversion layer with laser light to selectively melt/soften the adhesive layer by the obtained heat, selectively pasting the thin film element to the transferred material, and making the selectively pasted thin film element leave from the transferred material. COPYRIGHT: (C)2008,JPO&INPIT
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