| 摘要 |
PROBLEM TO BE SOLVED: To provide a film which has good heat resistance, mold release property, and film thickness accuracy in the production of a flexible printed circuit (FPC), does not form irregularity, when following the surface shape of a substrate having an electric circuit formed thereon to deform a mold release film, and does not form irregularity of biting quantity into the surface unevenness of a substrate having an electric circuit formed thereon, when heated and pressed on the production of FPC. SOLUTION: This film having thickness accuracy of≤10% and obtained by forming a poly 4-methyl-1-pentene composition which comprises 4-methyl-1-pentene homopolymer or a copolymer comprising 4-methyl-1-pentene and another 2 to 20C olefin and has a melt flow rate (MFR) of 1 to 50 g/10 min and has a mol. wt. distribution (Mw/Mn) of 11 to 20. A mold release film is the film. COPYRIGHT: (C)2008,JPO&INPIT
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