| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable wiring structure which can conduct between an uneven driver IC and a driving element without breaking, a device, a manufacturing method of the device, a droplet discharge head, a manufacturing method of the droplet discharge head, and a droplet discharge device. SOLUTION: An upper base 20 is provided on a lower base 10 via an adhesive layer 3, and wiring 34 is spread from the top surface of the upper base 20 up to the top surface of the lower base 10 through the side surface 35 of the upper base 20. A first conductive part 90 provided on the lower base 10 by the wiring 34 and a second conductive part 44 provided on the upper base 20 are electrically connected. The wiring 34 protrudes from the under surface of the upper base 20, and the protruding part contacts the first conductive part 90. COPYRIGHT: (C)2008,JPO&INPIT
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