| 摘要 |
The present invention wets the front surface of a substrate with a solvent in advance, then accelerates the substrate to a first number of rotations lower than a range of the numbers of rotations where a turbulence occurs on the front surface of the substrate, and starts supply of a resist solution to the central portion of the substrate during the acceleration to thereby apply the resist solution while spreading the resist solution outward on the substrate. Thereafter, the substrate is decelerated to a second number of rotations to adjust the distribution of the film thickness of the resist solution within a plane, and accelerated to a third number of rotations lower than the first number of rotations and higher than the second number of rotations to shake off the remaining resist solution. According to the present invention, in application of the resist solution by spin coating, the consumption of the resist solution can be reduced and a high uniformity of the film thickness of the resist film within a plane can be obtained.
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