| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the deterioration of the in-plane uniformity of a polished wafer caused by the abrasion of a retainer ring in a polishing device of a semiconductor wafer. <P>SOLUTION: The deterioration of the in-plane uniformity of a polished semiconductor wafer caused by a variation in the profile of the footprint of a retainer ring is compensated by measuring the amount of abrasion of the retainer ring at predetermined timing and changing the height or polishing conditions of the retainer ring more than reduction in the thickness of the retainer ring. <P>COPYRIGHT: (C)2008,JPO&INPIT |
