| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface mounting electronic component package capable of realizing signal transmission with less transmission loss and high cutoff frequency. <P>SOLUTION: The electronic component package equipped with a dielectric substrate 11 provided on the top surface thereof with an electronic component 12 sealed therein, includes a first signal line 15 connected to the electronic component 12 and a first earth conductor 13 formed on the top surface of the dielectric substrate 11, and includes a second signal line 19 connected with an external connection electrode 20 and a second earth conductor 16 formed on the lower surface of the dielectric substrate 11. The first earth conductor 13 and the second earth conductor 16 are connected via an earth conductor via hole 26, and an in-substrate signal line 21 connected with the first signal line 15 and the second signal line 19 is surrounded by the first earth conductor 13 and the second earth conductor 16 vertically and by the earth conductor via hole 26 laterally, and is provided in the dielectric substrate 11. <P>COPYRIGHT: (C)2008,JPO&INPIT |
