PROCESSING LIQUID AND REMOVING METHOD FOR ALKALI-SOLUBLE POLYMER RESIN LAYER, RESIST PATTERN FORMING METHOD, AND CIRCUIT BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an alkali-soluble polymer resin layer processing liquid which can form resist images without leaving developer residue irrespective of the size of through holes of the circuit board and without changing the side etching quantity, and its removing method, and also provide a resist pattern forming method and a circuit board manufacturing method. SOLUTION: This alkali-soluble polymer resin layer processing liquid contains at least one of the inorganic alkali compounds chosen from alkali metal carbonate, alkali metal phosporus, alkali metal hydroxide, and alkali metal silicate, at a high concentration and further contains a proper amount of at least one of sulfate and sulfite. The alkali-soluble polymer resin layer removing method uses this processing liquid. The resist pattern forming method and the circuit board manufacturing method use this alkali-soluble polymer resin layer removing method. COPYRIGHT: (C)2008,JPO&INPIT