发明名称 FLEXIBLE ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a flexible electronic device capable of suppressing cracks to be generated in transfer, improving durability against the bending stress of the device to be acquired, and having excellent indicated quality and electric characteristics. SOLUTION: This manufacturing method of the flexible electronic device, a manufacturing method of a flexible electronic device, includes a step of forming a base insulating film on a first substrate; a step of forming a semiconductor layer pattern on the base insulating film; a step of forming a gate insulating film on the base insulating film and the semiconductor pattern; a step of forming a gate electrode patten on the gate insulating film; a step of a first interlayer insulating film on the gate insulating film and the gate electrode pattern; and a step of removing the base insulating film, the gate insulating film, and the first interlayer insulating film on a portion where the semiconductor layer or the gate electrode pattern is not formed, thereby making an insulating film laminate to be an island. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007288078(A) 申请公布日期 2007.11.01
申请号 JP20060116247 申请日期 2006.04.20
申请人 SEIKO EPSON CORP 发明人 KOMATSU TOMOKO
分类号 H01L21/02;H01L21/336;H01L27/12;H01L29/786 主分类号 H01L21/02
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