| 摘要 |
PROBLEM TO BE SOLVED: To make the plane size of a base plate (whole device) small in a semiconductor device which is provided with a semiconductor constitution body called CSP on the base plate, provided with an insulator layer on the base substrate at a circumference of the semiconductor constitution body, provided with an upper-layer wiring on the semiconductor constitution body and insulator layer across an upper-layer insulator film, and provided with solder balls on connection pads of the upper-layer wiring. SOLUTION: A through-hole 41 for accommodating a chip component 42 is bored in the base plate 1 below the semiconductor constitution body 2. Consequently, the plane size of the base plate 1 (whole device) can be made small as compared with a case wherein the chip component 42 is provided on the base plate at a circumference of the semiconductor constitution body 2. COPYRIGHT: (C)2008,JPO&INPIT
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