SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND SUBSTRATE TREATMENT APPARATUS

摘要

A substrate cleaning apparatus capable of cleaning the entire periphery of a substrate end portion at a time by simple control without polishing the end portion and without generating plasma. The substrate cleaning apparatus has a loading table (204) on which a wafer (W) is placed, a heating means (210) for heating a wafer end portion, ultraviolet application means (220) for applying ultraviolet to the wafer end portion, and flow forming means (230) for forming a gas flow on the surface of the wafer end portion. The heating means, the ultraviolet application means, and the flow forming means are disposed near the wafer end portion so as to surround the wafer.