| 摘要 |
A semiconductor package module having no solder balls and a method of manufacturing the semiconductor package module are provided. The semiconductor package module includes a module board on which a plurality of semiconductor devices are able to be mounted, a semiconductor package bonded on the module board using an adhesive, being wire-bondable to the module board, and having already undergone an electrical final test, second wires electrically connecting second bond pads of the semiconductor package to bond pads of the module board; and a third sealing resin enclosing the second wires and the semiconductor package. Because the semiconductor package module does not use solder balls, degradation of solder joint reliability (SJR) can be prevented. Further, the use of a semiconductor package that has already undergone an electrical test can reduce degradation of the yield of a completed semiconductor package module. |
