| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which decreases the number of exposure mask to remarkably shorten the man-hours and period of time of a process for exposure, in the manufacturing method of the semiconductor device, in which an identification information is given on a chip. <P>SOLUTION: The semiconductor chip 11 is provided with an element forming region 12 and a chip position identification pattern 13 except the element forming region 12 while the chip identification pattern 13 is constituted of a positional information 14 in exposure shot and an exposure shot positional information 15. The positional information in exposure shot 14 is an information showing the position of a plurality of chip patterns in the mask employed for stepper exposure. Further, the exposure shot positional information shows the positions of exposure shot repeated across the upper part of the semiconductor wafer. The chip is specified so that the chip of some number in some number of times by showing these two kinds of information in the chip identification pattern 13. Furthermore, the chip identification pattern 13 can be formed by masks few in number by exposing exposure shot positional information with the size of exposure shot different from a normal size. <P>COPYRIGHT: (C)2008,JPO&INPIT |
