| 摘要 |
PROBLEM TO BE SOLVED: To provide a prober which accurately sets a temperature of devices under inspection to a desired temperature. SOLUTION: The prober connects each terminal of testers 21 and 22 to an electrode of a semiconductor device in order to inspect a plurality of the semiconductor devices formed on a Wafer W by the testers. A wafer holding method to hold the wafer W in a wafer chuck 11 of the prober includes processes to place a highly thermally conductive sheet 60 on the wafer chuck 11, and to place the wafer on the highly thermally conductive sheet 60 to hold. The wafer chuck 11 includes a lift pin 51. When the wafer W is held, its end is positioned at a lower side than a placing face 31. When the wafer is moved upward, its end moves to an upper side than the placing face. The highly thermally conductive sheet 60 has a pin hole 61 through which the lift pin 51 passes. COPYRIGHT: (C)2008,JPO&INPIT |
