| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate used for fabricating a wiring board. SOLUTION: Glass cloth is impregnated with resin, and the glass cloth impregnated with resin is stacked to a desired thickness to form a laminate. Copper foil having a surface roughness for a circuit is stacked on one or both of the surfaces of the laminate while causing a surface having a surface roughness to face the surface of the laminate, and the copper foil and the substrate are pressed and heated together to form the laminate. The laminate is used for fabricating a wiring board after chemically removing the copper foil of the laminate and being subjected to desmearing and electroless copper plating on the laminate. The resin impregnated in the glass cloth contains, as essential components, one of epoxy resin not containing at least one of second and third carbon atoms in a main skeleton, polyphenylene ether, and bismaleimide. Further, the resin is a resin composition containing an epoxy resin, a curing agent for an epoxy resin, and an inorganic filler. After desmearing, the laminate has a surface roughness of 0.1μm to 1.5μm in arithmetic mean roughness and the ten point height of irregularities of the laminate is 1μm to 6μm. COPYRIGHT: (C)2008,JPO&INPIT
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