| 摘要 |
A method for fabricating an interconnect comprising providing a carrier substrate, wherein the carrier substrate comprises a plurality of interconnect traces and a plurality of input/output contacts; providing a flexible substrate having a first side and a second side, disposing the second side of the sacrificial layer onto the first side of the flexible substrate to form a first assembly, disposing the carrier substrate onto the first assembly; and removing the sacrificial layer and the carrier substrate to form the interconnect.
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