| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin sealing device which can be easily manufactured, have a high heat input efficiency and reduced cycle time, and also can avoid generation of such a defect as warpage in a product. SOLUTION: In a resin sealing device 22 for sealing a substrate (seal target member) K having a semiconductor or the like built therein in a mold 24 by transfer molding, an upper part 26 of the mold is made up of first and second upper dies 30 and 32 separated as upper and lower parts and having a cull part 36 and a cavity 42, the second upper die 32 being overlapped on the first upper die 30. A heat insulator layer 34 is interposed between the first and second upper dies 30 and 32, and a local heater (heat source) 46 is disposed between the cull part 36 of the first upper die 30 and the heat insulator layer 34. COPYRIGHT: (C)2008,JPO&INPIT
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