| 摘要 |
PROBLEM TO BE SOLVED: To further improve moisture resistance by a small number of processes by eliminating a metallized contact metal removing process. SOLUTION: A metallized film is formed such that a metal evaporated electrode 3 is formed on a dielectric film 2. The metallized film is wound so that individual turns of the metal evaporated electrode 3 face each other via the dielectric film 2, and metallized contact electrodes 5 are formed on both end faces. Then, external terminals are so installed as to be exposed above the metallized contact electrodes 5 and provided at a capacitor element 1. The metallized film capacitor is formed by winding a plastic film 4 having a gas barrier property which is coated with a releasing agent around the capacitor element 1. COPYRIGHT: (C)2008,JPO&INPIT
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