| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology which can inspect a package substrate without requiring an equivalent circuit model. SOLUTION: An LSI package substrate design support system makes a computer execute a substrate design support program provided with following steps: a step which regenerates a pseudo-package substrate on a computer based on layout data of a package substrate, a step which regenerates an outside connection terminal provided with the package substrate on the pseudo-package substrate, a step which constitutes a power supply part supplying electric potential decided beforehand to the outside connection terminal regenerated on the pseudo-package substrate and applies potential outputted from the power supply to the outside connection terminal, a step which detects a signal waveform outputted from an output terminal corresponding to the outside connection terminal responding to the potential, and a step which verifies the layout of the package substrate based on the detected signal waveform. COPYRIGHT: (C)2008,JPO&INPIT
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